EMIRS200 KOH Wafer
606.255
4-inch wafer containing approximately 400 dies, supplied diced on UV-Tape. Wafer map included.
Features
- Chip size 3.2 x 3.2 mm²
- Membrane size 2 x 2 mm²
- Total Optical power 25 mW
- Electrical input power 450 mW
| Series | EMIRS200 Wafer |
|---|---|
| Dimensions (mm) | 3.2 x 3.2 mm² |
| Specs | |
|---|---|
| Optical Output Power | 25 mW |
| Input Power | 450 mW |
| Membrane | 2 x 2 mm² |
| Package | UV-Tape |
| Lead Time | 6 Weeks |
